| Description | Standard |
| SIZES | |
| Maximum finished board size inch | 20*22” |
| Standard finished board size inch | 10*16” |
| Maximum working panel size inch | 20*24” |
| THICKNESS | |
| Maximum finished thickness | 5mm |
| Maximum finished thickness 2 layer | 0.3mm |
| Minimum finished thickness 4 layer | 0.4mm |
| Board thickness tolerance | +-10% |
| Warpage/bow and twist-inch per inch | 0.7% |
| LAYER CONSTRUCTION | |
| Standard processed layer count | 2L ~ 16L |
| Maximum copper foil inner layer | 3oz |
| Maximum copper foil outer layer | 3oz |
| Miniumu core thickness | 0.075mm |
| Layer to layer registration | 0.075mm |
| Dielectric tolerance layer to layer | +-10% |
| ASPECT RATIO | |
| Maximum aspect ratio-plated through hole | 20:1 |
| Maximum aspect ratio-micro via hole | 0.8:1 |
| Maximum aspect ratio-buried via hole | 10:1 |
| MECHANICALLY DRILLED HOLE SIZES | |
| Minimum drill size versus thickness 1.2mm prior to plating | 0.15mm |
| Minimum drill size versus thickness 3.2mm prior to plating | 0.2mm |
| Minimum drill size versus 4.2mm prior to plating | 0.25mm |
| Minimum drill size mechanically drilled hole prior to plating | 0.15mm |
| Smallest finished PTH | 0.15mm |
| Max finished PTH | 6mm |
| Maximum hole diameter which can be plugged | 0.5mm |
| HOLE SIZE TOLERRANCE | |
| PTH standard | +-0.003" |
| NPTH | +-0.002" |
| True position tolerance | +-0.003" |
| TRACE WIDTH | |
| Minimum trace width inner layer | 0.003" |
| Typical trace width inner layer | 0.003" |
| Minimum trace width outer layer | 0.003" |
| Typical trace width outer layer | 0.004" |
| Etch tolerance 1/2 oz Cu | +-20% |
| Etch tolerance 1 oz Cu | +-20% |
| Etch tolerance 2 oz Cu | +-20% |
| TRACE SPACE | |
| Minimum space copper to copper inner layer | 0.003" |
| Typical space copper to copper inner layer | 0.004" |
| Minimum space copper to copper outer layer | 0.003" |
| Typical space copper to copper outer layer | 0.004" |
| Minimum space drill to copper | 0.01" |
| Minmum annular ring inner layer | 0.005" |
| Typical annular ring inner layer | 0.006" |
| Minmum annular ring outer layer | 0.005" |
| Typical annular ring outer layer | 0.006" |
| Minimum SMD land pattern pitch | 0.014" |
| Minimum plane clearance inner layer | 0.01" |
| Minimum plane clearance outer layer | 0.006" |
| TRACE IMPEDANCE | |
| Impedance typical value ohms | 100/50 |
| Impedance typical toerance | +-10% |
| BACK DRILL | |
| Back drill tolerance | L +/- 0.1mm |
| Back drill size | drill bit +0.15mm |
| Smallest drill | 0.2mm |
| Smallest back drill size | 0.35mm |
| CAVITY | |
| Cavity depth control | +-0.1mm |
| Resin flow | <250um |
| LAMINATE MATERIALS | |
| FR4 laminate thickness | 1.6mm |
| High Tg FR4-170 deg C | YES |
| Polymide | YES |
| PTFE Teflon | YES |
| Rogers ro4000 RO3000 | YES |
| OTHER TECHNOLOGIES | |
| Buried vias conventional | yes |
| Blind vias conventional | YES |
| Blind micro vias | YES |
| How many sequential layers of microvias one side | 3 |
| Via in pad | YES |
| Via on pad | YES |
| Non conductive via fill | YES |
| Conductive copper paste via fill | YES |
| SOLDER MASK AND LEGEND | |
| Nominal solder mask | 0.4mil |
| Minimym solder mask clearance | 0.0025" |
| SURFACE FINISHES | |
| HASL | YES |
| Electrolytic NI/Gold | YES |
| Electroless NI/immersion gold | YES |
| ENTEK OSP | YES |
| Soft gold | YES |
| Selective hard gold plating or immersion gold | YES |
| Immersion silver | YES |
| Immersion Tin | YES |
| ARTWORK FORMAT | |
| 274x | YES |
| ODB++ | YES |
| ELECTRICAL TEST | |
| Net list extraction | YES |
| Net list comparison | YES |
| Simultaneous top and bottom 100% net list | YES |
| Continuity | YES |
| Isolation | YES |
| Impedance test coupon | YES |
